Dandan Guo

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Institute of Robotics and Intelligent Manufacturing, The Chinese University of Hong Kong (Shenzhen)
Shenzhen, 518172
518172
Office: Daoyuan Building
gdd_xidian@126.com
guodandan@cuhk.edu.cn

Professional Services

Journal reviewer: IEEE TSP, JMLR

Conference reviewer: ICLR, NeurIPS,ICML, 2019-2022

© Dandan Guo